其主要工作原理是，通過壓電陶瓷將電信號轉(zhuǎn)換成超聲波（>20KHz），用超聲波對樣品內(nèi)部進行高精度地掃描，根據(jù)超聲波在不同密度材料中的傳播速度和反射系數(shù)的差異，獲得樣品內(nèi)部不同區(qū)域的超聲波透射或反射，再經(jīng)由軟件算法處理和成像。SAM的核心構(gòu)成為，電氣部件、機械裝置、聲學部件、軟件系統(tǒng)。
SONIX ECHO VS™ 是專為更高精度要求，更復(fù)雜元器件設(shè)計的新一代設(shè)備。
廣泛應(yīng)用在 Flip chips，Stacked die，Bumped die，Bonded wafers 等。
● 高分辨率下，掃描速度是傳統(tǒng)超聲波掃描顯微鏡的2.5倍
● 獨有的波形模擬器(Waveform Simulator)及波束仿真(Beam Emulator)
● 掃描分辨率小于1微米
● 水溫控制系統(tǒng)及紫外殺菌系統(tǒng)超高頻狀態(tài)工作下，信號更穩(wěn)定
To identify the smallest and most subtle defects in leading-edge packaged microelectronic applications, ECHO VS includes standard features such as heated water for optimum acoustic coupling, Flexible TAMI for efficient capture of the most useful data, Waveform Averaging for an improved signal-to-noise ratio, ICEBERG for improved image quality and MFCI for enhanced image quality in the most demanding applications. ECHO VS is the ultimate ultrasonic NDT equipment for molded flip chip, CSP, MCM, stacked die, MUF and other advanced packaging technologies.
- Detects air defects as thin as 0.01 micron and spatially resolves defects down to 5 microns.
- Image Enhancement Suite with heated water, waveform simulation and other innovations for industry-leading image quality in advanced packaging applications
- Image optimization for improved image quality in complex molded flip chips (MUF) and packages with polyimide layers
- Waveform averaging for improved signal-to-noise ratio
- Transducers from 15MHz through 300MHz, designed and matched in-house to address all types of applications and materials
- Stacked Die Imaging (SDI) (optional)
- Molded Flip Chip Imaging (MFCI)
